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Your search returned 9 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
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Year : 2003 Volume number : 26 Issue: 03 |
Material Characterization Of Fluorosilicone Gels For Automotive Application
(Article)
Subject:
Addition Cure
,
Consistency Of Gel
,
Flourosilicone
Author:
Judy Cheng Chean
Fay
Aloysius
Lee
Lee Choon
Liang
Raynard
Neo
page:
200
-
204
An Optimization Study Of Underfill Dispensing Volume
(Article)
Subject:
Flip Chip
,
Reliability
,
Underfill Dispensing Process
,
Dispensing
Author:
Yew Choon
Chia
Hong See
Yam
S.H.
Lim
K.S.
Chian
page:
205
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210
Evaluating The Influence Of Post-Mould Cure And Additives On The Viscoelastic Properties Of A Low Stress Epoxy Mould Compound
(Article)
Subject:
Cross-Linked
,
Network
,
Epoxy Mould Compound
,
Silicone
Author:
Spencer
Chew
Ah-Chin
Tan
page:
211
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215
Monitoring Wire Bonding Via Time-Frequency Analysis Of Horn Vibration
(Article)
Subject:
Bond Quality
,
Horn Vibration
,
Neural Network
,
Piezoelectric
Author:
Shih-Fu
Ling
Dong
Zhang
page:
216
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220
Ultrasonic Evaluation Of The Silicon/Copper Interfaces In Ic Packaging
(Article)
Subject:
Contact Transducers
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Cracks
,
Delamination
,
Die Attach
Author:
A.U.
Rehman
J.
Abdul
Y
Wang
N.
Guo
page:
221
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227
A Method Of The Measurement Of Moisture In Ic Packages Using Microwaves
(Article)
Subject:
Calibration Equation
,
Reflection Coefficient
,
Ic Packages
,
Microwaves
Author:
Yang
Ju
Hiroyuki
Abe
Masumi
Saka
page:
228
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231
Applications Of Infrared Microscopy To Ic And Mems Packaging
(Article)
Subject:
Die Bond
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Mems
,
Silicon
,
Wire Bonding
Author:
Alastair
Trigg
page:
232
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238
Microdeformation Analysis Of Packages And Interconnects To Improve Finite Element Models For Reliability Assessments
(Article)
Subject:
Csp
,
Fea
,
Cte
,
Micro Dac
Author:
Eberhard
Kaulfersch
Dietmar
Vogel
Bernd
Michel
page:
239
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244
Warpage In Plastic Packages, Effects Of Process Conditions, Geometry And Materials
(Article)
Subject:
Coplanarity
,
Cross-Shaped Die Paddle
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Full Square Paddle
,
Glass Transition Temperature
Author:
Janet W.Y.
Kong
Jang-Kyo
Kim
Matthew M.F.
Yuen
page:
245
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252
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